ST reshaping manufacturing footprint to invest in 300mm silicon, 200mm SiC, and technology R&D 2025-04-16 As part of the program announced in October 2024, STMicroelectronics of Geneva, Switzerland has disclosed further plans to reshape its global manufacturing footprint that will “future proof our integrated device manufacturer model with strategic
AI-Powered PCB Inspection: Defect Detection in Real Time with Microchip PolarFire® SoC FPGA and SpanIdea AI Technology 2025-04-27 Electronics manufacturers and engineers can now eliminate the inefficiencies of manual PCB quality inspections.